Flow Sensors in Handlers for Semiconductor Chip Testing

04/23 2025 346

Handlers are pivotal in the realms of integrated circuit design and packaging testing, typically paired with testers. In front-end design, they facilitate packaged chip-level testing, while in back-end testing, after chip packaging, the tester and handler work in tandem for final product testing, encompassing functional and electrical parameter evaluations to ascertain chip quality and classification. Domestic handlers primarily focus on finished chip product testing. The testing platform encompasses testers, handlers, test sockets, and other associated equipment and materials. The chip assembly stage process resembles wafer testing:

Transfer: The handler autonomously transfers chips to the test station, one by one.

Connection: The chip's pins are interfaced with the tester's functions via the test station's base and dedicated connection lines.

Judgment: The tester applies an input signal to the chip and collects the output to verify if the chip's functionality and performance adhere to design specifications.

Output: Test results are communicated to the handler via an interface, prompting the handler to mark, sort, collect, or tape the tested chips accordingly.

Handlers exhibit diversity, with significant variations in form factors tailored to user needs. They are categorized as gravity, translation, turret, and integrated testing and sorting machines, based on form factor and application scenarios. Gravity handlers offer simplicity and low investment; translation handlers boast broad applicability, advantageous in long test times or advanced packaging; turret handlers suit small, lightweight chips with short test times. Integrated testing and sorting machines amalgamate testing, visual measurement, laser marking, and taping functions. They too come in gravity, translation, turret, and other types, boasting complex structures and high technical barriers due to their multifaceted integration.

Handlers' ability to maneuver wafer chips hinges on the swing arm's adsorption effect. By managing airflow, chips are adsorbed and moved. Airflow control employs flow controllers or sensors to regulate or detect gas flow rates, achieving the desired adsorption pressure.

IGSensors recommends Silicon Microstructures' flow sensors, ideally suited for handler equipment. Specific parameters include:

The MFC2000 series mass flow controller utilizes a proprietary MEMS Thermal-D operation, eliminating gas sensitivity for similar diffusivity gases and enabling gas identification post-programming. It supports process control with a 100:1 dynamic range, controlling pressures from 0.1 to 0.8 MPa (15 to 120 PSL) and compensating temperatures from 0 to 50°C. Flow rates are selectable from 50 mL/min to 200 L/min, with digital RS485 Modbus communication and analog output.

The design facilitates mechanical connector replacement, offering optional double ferrules, VCR, UNF, and custom connectors upon request.

The FS4300 series gas mass flow sensor directly measures gas mass flow, bypassing bypass settings. Operating at up to 0.8 MPa, its measurement range spans 0~5 SLPM to 0~50 SLPM. Applications include anesthesia machines, endoscopes in medical equipment; welding machines, laser equipment, semiconductor testing equipment, gas mixing control in industrial settings; and atmospheric samplers in environmental monitoring.

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